Vulnerability CVE-2017-18173


Published: 2019-05-06   Modified: 2019-05-07

Description:
In case of using an invalid android verified boot signature with very large length, an integer underflow occurs in Snapdragon Mobile in SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016.

Type:

CWE-190

(Integer Overflow or Wraparound)

CVSS2 => (AV:L/AC:L/Au:N/C:C/I:C/A:C)

CVSS Base Score
Impact Subscore
Exploitability Subscore
7.2/10
10/10
3.9/10
Exploit range
Attack complexity
Authentication
Local
Low
No required
Confidentiality impact
Integrity impact
Availability impact
Complete
Complete
Complete
Affected software
Qualcomm -> Sd 425 firmware 
Qualcomm -> Sd 427 firmware 
Qualcomm -> Sd 430 firmware 
Qualcomm -> Sd 435 firmware 
Qualcomm -> Sd 450 firmware 
Qualcomm -> Sd 625 firmware 
Qualcomm -> Sd 810 firmware 
Qualcomm -> Sd 820 firmware 
Qualcomm -> Sd 835 firmware 
Qualcomm -> Sdm630 firmware 
Qualcomm -> Sdm636 firmware 
Qualcomm -> Sdm660 firmware 
Qualcomm -> Snapdragon high med 2016 firmware 

 References:
https://www.qualcomm.com/company/product-security/bulletins

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