Vulnerability CVE-2018-11277


Published: 2018-09-20

Description:
In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to potential access control issue.

Type:

CWE-732

CVSS2 => (AV:L/AC:L/Au:N/C:P/I:P/A:P)

CVSS Base Score
Impact Subscore
Exploitability Subscore
4.6/10
6.4/10
3.9/10
Exploit range
Attack complexity
Authentication
Local
Low
No required
Confidentiality impact
Integrity impact
Availability impact
Partial
Partial
Partial
Affected software
Qualcomm -> Sd820 firmware 
Qualcomm -> Msm8909w firmware 
Qualcomm -> Sd820a firmware 
Qualcomm -> Msm8996au firmware 
Qualcomm -> Sd835 firmware 
Qualcomm -> Sd205 firmware 
Qualcomm -> Sd845 firmware 
Qualcomm -> Sd210 firmware 
Qualcomm -> Sda660 firmware 
Qualcomm -> Sd212 firmware 
Qualcomm -> Sd415 firmware 
Qualcomm -> Sd430 firmware 
Qualcomm -> Sd450 firmware 
Qualcomm -> Sd615 firmware 
Qualcomm -> Sd616 firmware 
Qualcomm -> Sd617 firmware 
Qualcomm -> Sd625 firmware 
Qualcomm -> Sd650 firmware 
Qualcomm -> Sd652 firmware 
Qualcomm -> Sd810 firmware 

 References:
https://www.qualcomm.com/company/product-security/bulletins

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