Vulnerability CVE-2021-35119


Published: 2022-06-14

Description:
Potential out of Bounds read in FIPS event processing due to improper validation of the length from the firmware in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile

 References:
https://www.qualcomm.com/company/product-security/bulletins/june-2022-bulletin

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