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Vulnerability CVE-2022-25677
Published: 2022-12-13
| Description: |
Memory corruption in diag due to use after free while processing dci packet in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking |
References: |
https://www.qualcomm.com/company/product-security/bulletins/december-2022-bulletin
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