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Vulnerability CVE-2022-25686
Published: 2022-09-16
| Description: |
Memory corruption in video module due to buffer overflow while processing WAV file in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables |
References: |
https://www.qualcomm.com/company/product-security/bulletins/september-2022-bulletin
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