Vulnerability CVE-2021-30341


Published: 2022-06-14

Description:
Improper buffer size validation of DSM packet received can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables

 References:
https://www.qualcomm.com/company/product-security/bulletins/april-2022-bulletin

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